Art

J-GLOBAL ID：201302204681786529   Reference number：13A1763811

Grain Size Variation during Low Temperature Creep and Tensile Deformation of Ultrafine-Grained Copper

超微細結晶粒銅の低温クリープと引張変形中の粒径変化

Author (5)： OKUBO Satoshi (Dep. of Materials Sci. and Engineering, Tokyo Inst. of Technol.) ,  MIYAJIMA Yoji (Dep. of Materials Sci. and Engineering, Tokyo Inst. of Technol.) ,  FUJII Toshiyuki (Dep. of Metallurgy and Ceramics Sci., Tokyo Inst. of Technol.) ,  ONAKA Susumu (Dep. of Materials Sci. and Engineering, Tokyo Inst. of Technol.) ,  KATO Masaharu (Dep. of Materials Sci. and Engineering, Tokyo Inst. of Technol.)
Material： Materials Transactions  (Mater Trans)
Volume： 54  Issue： 9  Page： 1605-1611 (J-STAGE)  Publication year： 2013 
JST Material Number： G0668A  ISSN： 1345-9678  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： *copper ,  *tensile deformation ,  crystal grain size ,  extrusion ,  particle size distribution ,  activation energy ,  mechanism ,  tensile test ,  *creep ,  stress strain curve ,  severe plastic deformation
Semi thesaurus term： ECAP ,  ultrafine grained material ,  deformation mechanism

JST classification (4)： Mechanical properties  (WB02030U) ,  Metallic materials  (HC06020Z) ,  Transformation structures,work structures  (WB01030N) ,  Extrusion  (WC04020A)

Reference (45)：

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Terms in the title (6)： 微細結晶粒 ,  銅 ,  低温 ,  クリープ ,  引張変形 ,  粒径