Art

J-GLOBAL ID：201402273523005560   Reference number：14A1187062

Relationship between polishing performance and viscoelasticity of epoxy resin polishing pads

エポキシ樹脂研磨パッドの粘弾性と研磨特性

Author (4)： MURATA JUNJI (近畿大) ,  INAZAWA MOTOMU (立命館大 大学院) ,  TANI YASUHIRO (立命館大) ,  ZHANG Yu (立命館大)
Material： 日本機械学会論文集(Web)  (Bulletin of the JSME (Web))
Volume： 80  Issue： 817  Page： SMM0253 (WEB ONLY)  Publication year： 2014 
JST Material Number： U0182B  ISSN： 2187-9761  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)

Thesaurus term： *epoxy resin ,  *coated abrasive ,  viscoelasticity ,  *polishing (machining) ,  characteristic ,  polyurethane ,  loss tangent ,  efficiency (labor) ,  abrasive grain ,  velocity ,  cerium oxide ,  Glass ,  mechanical property ,  *machining

JST classification (2)： Grinding  (QC03000R) ,  Epoxy resins  (YH07040I)

Reference (8)：

• Charns, L., Sugiyama, M. and Philipossian, A., Mechanical properties of chemical mechanical polishing pads containing water-soluble particles, thin solid film, Vol. 485 (2005), pp. 188-193.
• Ichinoho, N., Yamaguchi, Y., Sakurai, T., Tani, Y. and Kim, T., Development of composite abrasives considering cleanability of workpieces and their polishing characteristics, Transactions of the Japan Society of Mechanical Engineers, Series C, Vol. 75, No. 757 (2009), pp. 2429-2439 (in Japanese).
• Ikeda, H., Akagami, Y., Uneda, M., Ohnishi, O., Kurokawa, S. and Doi, T., Development of a high efficiency polishing technology using abrasive control technique with AC electric field for glass substrates: -Effect of an AC electric field on slurry behavior and polishing characteristics-, Journal of the Japan Society for Precision Engineering, Vol. 77, No. 12 (2011), pp. 1146-1150 (in Japanese).
• Kim, N-H., Seo, Y-J. and Lee, W-S., Effects of silica slurry temperature on chemical mechanical polishing for tetraethyl orthosilicate film, Japanese Journal of Applied Physics, Vol. 44, No. 40 (2005), pp. L1256-L1258.
• Murata, J., Tani, Y., Hirokawa, R., Nomura, N., Zhang, Y. and Uno, J., Development of epoxy resin polishing pads for glass polishing, Transactions of the Japan Society of Mechanical Engineers, Series C, Vol. 77, No. 777 (2011), pp. 2153-2161(in Japanese) .

Terms in the title (4)： エポキシ樹脂 ,  研磨パッド ,  粘弾性 ,  研磨特性