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J-GLOBAL ID:201502211496220995   Reference number:15A1197355

Metal nanodot arrays fabricated via seed-mediated electroless plating with block copolymer thin film scaffolding

ブロックコポリマー薄膜を足場とするシード媒介無電解メッキにより作製した金属ナノドットアレイ
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Material:
Volume: 26  Issue: 39  Page: 395302,1-7  Publication year: Oct. 02, 2015 
JST Material Number: W0108A  ISSN: 0957-4484  CODEN: NNOTER  Document type: Article
Article type: 原著論文  Country of issue: United Kingdom (GBR)  Language: ENGLISH (EN)
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Inorganic compounds and elements in general  ,  Electroless plating 
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