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J-GLOBAL ID:201502213042134132   Reference number:15A1063685

Thermal Stress-Based Diffusion Bonding Method: the Case of Oxygen Free Copper to 316L Stainless Steel

熱応力に基づく拡散接合法;無酸素銅と316Lステンレス鋼との場合
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Volume: 56  Issue: 10  Page: 1683-1687 (J-STAGE)  Publication year: 2015 
JST Material Number: G0668A  ISSN: 1345-9678  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: ENGLISH (EN)
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Welding techniques 
Reference (21):
  • 1) D. E. Houston: Method and Apparatus for Thermo-Compression Diffusion Bonding, (United State Patent 4252263, 1981).
  • 2) O. Ohashi and H. Endou: Collected Abstracts of the 2010 Spring Meeting of the Japan Inst. Metals, (2011) No. 646 (DVD).
  • 3) K. Aihara, M. Narui, O. Ohashi and T. Ishiguro: J. Jpn. Res. Inst. Adv. Copper-Base Mater. Technol. 53 (2014) 203–209.
  • 4) O. Ohashi, S. Meguro and T. Yamagata: J. Japan Inst. Metals 59 (1995) 319–324.
  • 5) K. Kotani, K. Ikeuchi and F. Matsuda: Q. J. Jpn. Weld. Soc. 14 (1996) 382–388.
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