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J-GLOBAL ID:201502215331636777   Reference number:15A0808692

Effects of Internal Stress of Electroless Nickel Plating on Solder Joining Strength

無電解ニッケルめっきの内部応力がはんだ接合強度に及ぼす影響
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Volume: 18  Issue:Page: 253-260  Publication year: Jul. 01, 2015 
JST Material Number: S0579C  ISSN: 1343-9677  Document type: Article
Article type: 解説  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Printed circuits  ,  Materials of solid-state devices 
Reference (10):
  • 1) 渡邉秀人:“微細配線への無電解金めっきプロセス,”表面技術,Vol. 58, No. 2, pp. 92-22, 2007
  • 2) 小田幸典:“無電解ニッケル/パラジウム/金めっき皮膜の鉛フリーはんだ特性,”表面技術,Vol. 58, No. 2, pp. 109-112, 2007
  • 3) 田嶋和貴:“実装用表面処理:無電解Ni/無電解Pd/置換金めっき(ENEPIG),”表面技術,Vol. 62, No. 8, pp. 387-391, 2011
  • 4) 江尻芳則,櫻井健久,荒山貴慎,鈴木邦司,坪松良明,畠山修一,有家茂晴,廣山幸久,長谷川清:“半導体パッケージ基板用無電解Ni/Pd/Auめっき技術 (第1報) ~はんだボール接続信頼性に及ぼす無電解Niめっき膜厚の影響~,”エレクトロニクス実装学会誌,Vol. 15, No. 1, pp. 82-95, 2012
  • 5) 岩松克茂,大塚邦顕,内藤 薫:“無電解めっき皮膜の内部応力,”表面技術,Vol. 43, No. 7, pp. 656-666, 1992
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