Art

J-GLOBAL ID：201502261254096587   Reference number：15A0457109

Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn-Bi based lead-free solder

Sn-Bi基鉛フリーはんだの微細構造,熱力学的特性および機械的性質に及ぼすInの効果

Author (6)： CHEN Xu (School of Materials Sci. and Engineering, Southeast Univ., Nanjing 211189, CHN) ,  XUE Feng (School of Materials Sci. and Engineering, Southeast Univ., Nanjing 211189, CHN) ,  XUE Feng (Jiangsu Key Lab. for Advanced Metallic Materials, Southeast Univ., Nanjing 211189, CHN) ,  ZHOU Jian (School of Materials Sci. and Engineering, Southeast Univ., Nanjing 211189, CHN) ,  ZHOU Jian (Jiangsu Key Lab. for Advanced Metallic Materials, Southeast Univ., Nanjing 211189, CHN) ,  YAO Yao (School of Materials Sci. and Engineering, Southeast Univ., Nanjing 211189, CHN)
Material： Journal of Alloys and Compounds  (J Alloy Compd)
Volume： 633  Page： 377-383  Publication year： Jun. 05, 2015 
JST Material Number： D0083A  ISSN： 0925-8388  Document type： Article
Article type： 原著論文  Country of issue： Netherlands (NLD)  Language： ENGLISH (EN)

Thesaurus term： *solder ,  lead ,  tin containing alloy ,  indium additive alloy ,  intermetallic compound ,  bismuth base alloy ,  *additive effect ,  precipitate(phase separation) ,  tensile strength ,  heterogeneous reaction ,  copper ,  substrate(plate) ,  wetting(liquid) ,  micro structure ,  *indium ,  solid-liquid interface
Semi thesaurus term： *Pb free solder ,  interface reaction ,  copper board

JST classification (2)： Brazing  (WC07050C) ,  Transformation structures,work structures  (WB01030N)

Terms in the title (6)： Sn ,  Bi ,  鉛フリーはんだ ,  微細構造 ,  熱力学的特性 ,  機械的性質