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J-GLOBAL ID：201502268390966816   Reference number：15A0458264

Three-Dimensional Integrated CMOS Image Sensors with Pixel-Parallel A/D Converters Fabricated by Direct Bonding of SOI Layers

SOI基板の直接接合を用いた画素並列A/D変換方式3次元構造CMOSイメージセンサ

Author (9)： GOTO MASAHIDE (NHK 放送技研) ,  HAGIWARA KEI (NHK 放送技研) ,  IGUCHI YOSHINORI (NHK 放送技研) ,  OTAKE HIROSHI (NHK 放送技研) ,  SARAYA TAKUYA (東大) ,  KOBAYASHI MASAHARU (東大) ,  HIGURASHI EIJI (東大) ,  TOSHIYOSHI HIROSHI (東大) ,  HIRAMOTO TOSHIRO (東大)
Material： 電子情報通信学会技術研究報告  (IEICE Technical Report (Institute of Electronics, Information and Communication Engineers))
Volume： 114  Issue： 421(SDM2014 135-146)  Page： 25-28  Publication year： Jan. 20, 2015 
JST Material Number： S0532B  ISSN： 0913-5685  Document type： Proceedings
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)

Thesaurus term： *image sensor ,  *structure ,  AD conversion ,  *parallel processing ,  printed board ,  projected image ,  transmission speed
Semi thesaurus term： *CMOS Image Sensor ,  Silicon On Insulator substrate ,  frame rate ,  *three-dimensional structure ,  ultra high resolution image

JST classification (1)： Semiconductor integrated circuit  (NC03162T)

Reference (11)：

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• S. Kleinfelder, S. Lim, X. Liu, and A. El Gamal, "A 10000 Frames/s CMOS Digital Pixel Sensor," IEEE Journal of Solid-State Circuits, Vol. 36, No. 12, pp. 2049-2059 (2001).
• M. Goto, K. Hagiwara, Y. Iguchi, H. Ohtake, T. Saraya, E. Higurashi, H. Toshiyoshi, and T. Hiramoto, "Three-Dimensional Integrated CMOS Image Sensors with Pixel-Parallel A/D Converters Fabricated by Direct Bonding of SOI Layers," IEDM Tech. Dig., 4.2 (2014).
• M. Goto, K. Hagiwara, Y. Iguchi, H. Ohtake, T. Saraya, E. Higurashi, H. Toshiyoshi, and T. Hiramoto, "Three-Dimensional Silicon-on-Insulator Integrated Circuits with NFET and PFET on Separate Layers Using Au/SiO₂ Hybrid Bonding," IEEE Transactions on Electron Devices, Vol. 61, No. 8, pp. 2886-2892 (2014).

Terms in the title (5)： SOI基板 ,  直接接合 ,  画素 ,  3次元構造 ,  CMOSイメージセンサ