J-GLOBAL ID:201602008390910221   Reference number:58A0032812

Grain Growth and Flecking in Electroplated Copper Caused by Cyclic Stress.

Author (2):
Volume: 105  Issue:Page: 384-386  Publication year: 1958 
JST Material Number: C0285A  ISSN: 0013-4651  CODEN: JESOAN  Document type: Article
Country of issue: United States (USA) 
Terms in the title (4):
Terms in the title
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