Art
J-GLOBAL ID：201602013029433552   Reference number：69A0220020

Controlled collapse reflow chip joining.

崩壌制御reflowチップ接続
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Author (1)：
MILLER L F

About MILLER L F


Material：
IBM J Res Dev  (IBM Journal of Research and Development)

About IBM J Res Dev


Volume： 13  Issue： 3  Page： 239-250  Publication year： 1969 
JST Material Number： D0061B  ISSN： 0018-8646  CODEN： IBMJAE  Document type： Article
Article type： 解説  Country of issue： United States (USA)  Language： ENGLISH (EN)
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集積回路

About 集積回路


Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
reflow溶接法

About reflow溶接法

, 
reflow溶接法(チッ背ブ接続)

About reflow溶接法(チッ背ブ接続)

, 
チップ接読

About チップ接読

, 
チップ接読(ハイブリッド回路)

About チップ接読(ハイブリッド回路)

, 
チッ背ブ接続

About チッ背ブ接続

, 
ハイブリッド回路

About ハイブリッド回路

, 
崩壊制御チッブ接続

About 崩壊制御チッブ接続

, 
崩壊制御チッブ接続(集積回路)

About 崩壊制御チッブ接続(集積回路)



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