Art

J-GLOBAL ID：201602214121880101   Reference number：16A0741732

Microstructure and thermoelectric properties of hot-extruded Bi-Te-Se bulk materials

熱間押出しBi-Te-Seバルク材の微細構造と熱電特性

Author (4)： Wang Zhi-Lei (Department of Mechanical and Aerospace Engineering, Graduate School of Engineering, Tottori University, Koyama-minami 4-101, Tottori 680-8552, Japan) ,  Akao Takahiro (Department of Mechanical and Aerospace Engineering, Graduate School of Engineering, Tottori University, Koyama-minami 4-101, Tottori 680-8552, Japan) ,  Onda Tetsuhiko (Department of Mechanical and Aerospace Engineering, Graduate School of Engineering, Tottori University, Koyama-minami 4-101, Tottori 680-8552, Japan) ,  Chen Zhong-Chun (Department of Mechanical and Aerospace Engineering, Graduate School of Engineering, Tottori University, Koyama-minami 4-101, Tottori 680-8552, Japan)
Material： Journal of Alloys and Compounds  (J Alloy Compd)
Volume： 663  Page： 134-139  Publication year： Apr. 05, 2016 
JST Material Number： D0083A  ISSN： 0925-8388  Document type： Article
Article type： 原著論文  Country of issue： Netherlands (NLD)  Language： ENGLISH (EN)

Thesaurus term： electrical characteristic ,  *micro structure ,  *hot extrusion ,  *tellurium base alloy ,  bismuth containing alloy ,  selenium containing alloy ,  mechanical alloying ,  texture(metal) ,  bottom face ,  transport coefficient ,  electric resistance ,  thermal conductivity ,  performance index ,  hardness ,  N-type semiconductor ,  thermoelectric material ,  preferred orientation ,  grain refinement ,  thermoelectric effect
Semi thesaurus term： Seebeck coefficient ,  thermoelectric figure of merit ,  thermoelectric characteristic

Author keywords (4)： Bismuth telluride ,  Thermoelectric materials ,  Mechanical alloying ,  Hot extrusion

JST classification (2)： Transformation structures,work structures  (WB01030N) ,  Electrical properties  (WB02010Y)

Terms in the title (7)： 熱間押出し ,  Bi ,  Te ,  Se ,  バルク材 ,  微細構造 ,  熱電特性