Art

J-GLOBAL ID：201602270534080491   Reference number：16A0652133

Polymer surface treatment to reduce RDL leakage and solve delamination issue: YE: Yield enhancement/learning

RDL漏れを減少させ,剥離問題を解くための高分子表面処理:YE収量増強/学習【Powered by NICT】

Author (6)： Huang W. L. (Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan) ,  Wong J. J. (Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan) ,  Huang Danial (Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan) ,  Chang K. P. (Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan) ,  Su H. S. (Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan) ,  Ku Harry (Backend Integration Development Department, Taiwan Semiconductor Manufacturing Company, Ltd., Tainan, Taiwan)
Material： IEEE Conference Proceedings  (IEEE Conf Proc)
Volume： 2016  Issue： ASMC  Page： 456-459  Publication year： 2016 
JST Material Number： W2441A  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)

Abstract/Point： IC backend chip scale package ...

Register(free) or Log In to access     To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=16A0652133&from=J-GLOBAL&jstjournalNo=W2441A") }}

Thesaurus term： interface (surface) ,  polymer membrane ,  reliability (property) ,  failure rate ,  redistribution ,  adhesion (bond) ,  *macromolecule ,  plasma ,  routing ,  moisture ,  high temperature ,  leakage current ,  robustness ,  reliability test ,  communication operation ,  high humidity

JST classification (1)： Mobile communication  (ND08030H)

Terms in the title (4)： 高分子表面 ,  収量 ,  増強 ,  学習