Art
J-GLOBAL ID:201602274322601217   Reference number:16A1125640

TSV Array-Based 3D ICs Design Exploration and Optimization

TSVに基づく三次元統合回路の最適化設計に関する研究【JST・京大機械翻訳】
Author (4):
Material:
Volume: 33  Issue:Page: 129-132  Publication year: 2016 
JST Material Number: C2387A  ISSN: 1000-7180  Document type: Article
Article type: 原著論文  Country of issue: China (CHN)  Language: CHINESE (ZH)
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This paper analysis TSV array’...
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Printed circuits  ,  Semiconductor integrated circuit 
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