Art

J-GLOBAL ID：201602282140358255   Reference number：16A0502229

Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn-0.7Cu solder for high temperature packaging application

高温パッケージング用のSn-0.7Cuはんだによる超音波支援ダイボンディングによる金属間接合の急速生成

Author (3)： Ji Hongjun (Shenzhen Key Laboratory of Advanced Materials, Shenzhen Graduate School, Harbin Institute of Technology, HIT Campus, Shenzhen University Town, Xili, Nanshan, Shenzhen 518055, PR China) ,  Qiao Yunfei (Shenzhen Key Laboratory of Advanced Materials, Shenzhen Graduate School, Harbin Institute of Technology, HIT Campus, Shenzhen University Town, Xili, Nanshan, Shenzhen 518055, PR China) ,  Li Mingyu (Shenzhen Key Laboratory of Advanced Materials, Shenzhen Graduate School, Harbin Institute of Technology, HIT Campus, Shenzhen University Town, Xili, Nanshan, Shenzhen 518055, PR China)
Material： Scripta Materialia  (Scr Mater)
Volume： 110  Page： 19-23  Publication year： Jan. 01, 2016 
JST Material Number： B0915A  ISSN： 1359-6462  Document type： Article
Article type： 短報  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)

Thesaurus term： *tin base alloy ,  copper containing alloy ,  *solder ,  ultrasonic welding ,  *die bonding ,  *intermetallic compound ,  heat resistance ,  IC package ,  metal structure (microstructure) ,  thermal conductivity ,  joint (tool) ,  shear strength ,  nickel containing alloy ,  compound semiconductor ,  wide band gap semiconductor ,  organization ,  mechanical property ,  strength
Semi thesaurus term： wide band-gap semiconductor

Author keywords (5)： Ultrasonic-assisted soldering ,  Die bonding ,  Microstructure ,  Intermetallic joint ,  Thermal conductivity

JST classification (2)： Connecting parts  (NA05050Z) ,  Brazing  (WC07050C)

Terms in the title (6)： パッケージング ,  Sn ,  はん ,  超音波 ,  支援 ,  ダイボンディング