Art

J-GLOBAL ID：201702215965747200   Reference number：17A0299898

Diffusion alloying of Cu-C induced by high current pulsed electron beam

大電流パルス電子ビームによって誘起されるCU-C拡散合金化【JST・京大機械翻訳】

Author (6)： Guan Qingfeng (School of Materials Science and Engineering,Jiangsu University) ,  Huang Wei (School of Materials Science and Engineering,Jiangsu University) ,  Li Huaifu (School of Materials Science and Engineering,Jiangsu University) ,  Gong Xiaohua (School of Materials Science and Engineering,Jiangsu University) ,  Zhang Conglin (School of Materials Science and Engineering,Jiangsu University) ,  Lyu Peng (School of Materials Science and Engineering,Jiangsu University)
Material： Jilin Daxue Xuebao. Gongxue Ban  (Journal of Jilin University. Engineering and Technology Edition)
Volume： 46  Issue： 6  Page： 1967-1973  Publication year： 2016 
JST Material Number： W1016A  ISSN： 1671-5497  CODEN： JDXGAH  Document type： Article
Article type： 原著論文  Country of issue： China (CHN)  Language： CHINESE (ZH)

Abstract/Point： High Current Pulsed Electron B...

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Thesaurus term： X-ray diffraction ,  micro structure ,  scanning electron microscope ,  *alloying ,  wear characteristics ,  nano particle ,  transmission electron microscope ,  flake ,  lattice defect ,  phase constitution ,  solid solubility
Semi thesaurus term： 高密度 ,  真空焼結 ,  *パルス電子ビーム ,  *大電流 , 【Automatic Indexing@JST】

Author keywords (6)： metallic material ,  high current pulsed electron beam(HCPEB) ,  Cu-C composite material ,  solid solution ,  diffusion ,  friction and wear properties

JST classification (1)： Photochemical reactions  (CB08020F)

Terms in the title (5)： 大電流 ,  パルス電子ビーム ,  誘起 ,  拡散 ,  合金化