Art

J-GLOBAL ID：201702244316465818   Reference number：17A0096635

Effect of Sn-3.0Ag-0.5Cu-3.0Bi solder on microstructure of vacuum soldered joints of SiCP/6063Al composite

SN-3.0AG-0.5CU-3.0BIはんだの真空ろう付継手のミクロ組織に及ぼす影響を研究した。【JST・京大機械翻訳】

Author (6)： Fan Xiaojie (Department of Materials Science and Engineering,Henan Polytechnic University) ,  Xu Dongxia (Department of Materials Science and Engineering,Henan Polytechnic University) ,  Wang Peng (Department of Materials Science and Engineering,Henan Polytechnic University) ,  Niu Jitai (Department of Materials Science and Engineering,Henan Polytechnic University, State Key Laboratory of Advanced Welding Production Technology) ,  Wang Dongbin (Department of Materials Science and Engineering,Henan Polytechnic University) ,  Chen Sijie (Department of Materials Science and Engineering,Henan Polytechnic University)
Material： Bingqi Cailiao Kexue yu Gongcheng  (Ordnance Material Science and Engineering)
Volume： 39  Issue： 5  Page： 36-39  Publication year： 2016 
JST Material Number： C2398A  ISSN： 1004-244X  Document type： Article
Article type： 原著論文  Country of issue： China (CHN)  Language： CHINESE (ZH)

Abstract/Point： SiCp/6063Al composites were so...

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Thesaurus term： *vacuum brazing ,  *brazing joint ,  interface (surface) ,  *brazing ,  weld zone ,  alloy ,  crystal structure ,  electroless plating ,  nickel plating ,  composite material ,  micro structure ,  *solder ,  hygroscopicity ,  eutectic structure

Author keywords (4)： SiCp/6063Al composite ,  eutectic structure ,  chemical affinity ,  vacuum soldering

JST classification (1)： Brazing  (WC07050C)

Terms in the title (5)： はんだ ,  真空 ,  ろう付継手 ,  ミクロ組織 ,  研究