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J-GLOBAL ID：201702271082300490   Reference number：17A0214197

BEOL compatible graphene/Cu with improved electromigration lifetime for future interconnects

BEOLは将来の相互接続のための改良されたエレクトロマイグレーション寿命と互換性のあるグラフェン/銅【Powered by NICT】

Author (6)： Li Ling (Department of Electrical Engineering and Stanford SystemX Alliance, Stanford University, Stanford, CA, USA) ,  Zhu Zhongwei (Lam Research Corp., Fremont, CA, USA) ,  Wang Tao (Department of Electrical Engineering and Stanford SystemX Alliance, Stanford University, Stanford, CA, USA) ,  Currivan-Incorvia Jean A. (Department of Electrical Engineering and Stanford SystemX Alliance, Stanford University, Stanford, CA, USA) ,  Yoon Alex (Lam Research Corp., Fremont, CA, USA) ,  Wong H.-S. Philip (Department of Electrical Engineering and Stanford SystemX Alliance, Stanford University, Stanford, CA, USA)
Material： IEEE Conference Proceedings  (IEEE Conf Proc)
Volume： 2016  Issue： IEDM  Page： 9.5.1-9.5.4  Publication year： 2016 
JST Material Number： W2441A  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)

Abstract/Point： We demonstrate a method to gro...

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Thesaurus term： *Copper ,  *graphene ,  complex (substance) ,  *interconnection ,  density functional method ,  pattern formation ,  electrical resistivity ,  *electromigration ,  metal wire ,  current density ,  *interchangeability ,  etching
Semi thesaurus term： *BEOL , 【Automatic Indexing@JST】

JST classification (2)： Measurement,testing and reliability of solid-state devices  (NC03040G) ,  Manufacturing technology of solid-state devices  (NC03030V)

Terms in the title (7)： BEOL ,  相互接続 ,  エレクトロマイグレーション ,  寿命 ,  互換性 ,  グラフェン ,  銅