Art

J-GLOBAL ID：201702285175065260   Reference number：17A1477815

Siウエハのロータリ研削における砥粒貫入角度が加工特性に及ぼす影響

Author (4)： KUSUYAMA JUMPEI (防衛大) ,  YUI AKINORI (防衛大) ,  KITAJIMA TAKAYUKI (防衛大) ,  ITO TOSHIHIRO (岡本工作機械製作所)
Material： 砥粒加工学会誌  (Abrasive Technology)
Volume： 61  Issue： 11  Page： 607-612  Publication year： Nov. 01, 2017 
JST Material Number： L0473A  ISSN： 0914-2703  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)

Thesaurus term： *wafer ,  silicon ,  *grinding ,  abrasive grain ,  angle ,  *machining condition ,  grinding stone ,  rotational frequency ,  outer diameter ,  contact ,  area ,  depth of cut ,  machined surface ,  damage and injury ,  surface roughness ,  spindle(machine element) ,  optimum condition ,  machining accuracy ,  grinder

JST classification (1)： Manufacturing technology of solid-state devices  (NC03030V)

Reference (5)：

• 1) 2004 International Technology Roadmap for Semiconductors, Front end process, Table 67 (2015).
• 2) Tung-Chuan WU, Noboru MORITA and Yoshitaro YOSHIDA: Study on the Diamond Cutting of Silicon Single Crystal : 1st Report, The Effect of Brittle-Ductile Transition on Surface Integrity, Transactions of the Japan Society of Mechanical Engineers. Series C., 59, 557 (1993), 283-288 (in Japanese).
• 3) Yutaro EBINA, Kohei ISHIKAWA, Libo ZHOU, Jun SHIMIZU, Teppei ONUKI and Hirotaka OJIMA: Effects of the grain size uniformity on wafer surface topography in large scale Si wafer grinding, Abrasive Technology Conference 2015 (2015), 32 (in Japanese).
• 4) Okamoto Machine Tool Works, Ltd. HP, http://www.okamoto.co.jp/ (accessed on 21 June, 2017)
• 5) Shigeki OKUYAMA, Atsunobu UNE, Akinori YUI and Hirofumi SUZUKI: Fundamentals of Machinig Thechnology, CORONA PUBLISHING CO., LTD. (2013), 19 (in Japanese).

Terms in the title (6)： Siウエハ ,  ロータリ ,  研削 ,  砥粒 ,  貫入 ,  加工特性