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J-GLOBAL ID:201802211176765169   Reference number:18A1695954

常温接合を用いた混成半導体集積回路HySICの試作

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Volume: 2018  Issue: ソサイエティ大会  Page: ROMBUNNO.C-2-24  Publication year: Aug. 28, 2018 
JST Material Number: G0508B  ISSN: 1349-144X  Document type: Proceedings
Article type: 短報  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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Rectifiers  ,  Hydrid integrated circuit 
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