Art
J-GLOBAL ID:201802232001163429   Reference number:18A0597460

国内における電子機器サーマルマネージメントの動向 高発熱密度パワーエレクトロニクスの沸騰浸漬冷却

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Material:
Volume: 21  Issue:Page: 122-125  Publication year: Mar. 01, 2018 
JST Material Number: S0579C  ISSN: 1343-9677  Document type: Article
Article type: 原著論文  Country of issue: Japan (JPN)  Language: JAPANESE (JA)
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All keywords is available on JDreamIII(charged).
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JST classification (1):
JST classification
Category name(code) classified by JST.
Heat exchangers,coolers 
Reference (18):
  • 1) K. Yuki, J. Abei, H. Hashizume, and S. Toda: “Super-High Heat Flux Removal Using Sintered Metal Porous Media,” Journal of Thermal Science, Vol. 14, No. 3, pp. 272-280, 2005
  • 2) K. Yuki and K. Suzuki: “Development of Functional Porous Heat Sink for Cooling High-Power Electronic Devices,” Transactions of The Japan Institute of Electronics Packaging, Vol. 5, No. 1, pp. 69-74, 2012
  • 3) K. Takai, K. Yuki, and A. Sagara: “Heat Transfer Performance of EVAPORON-3 Developed for an Enlarged Heat Transfer Surface of Divertor,” Plasma and Fusion Research, Vol. 12, 1405015, 2017
  • 4) 結城和久,鈴木康一:“高熱流束環境に適した新しいポーラス体の提案,”熱工学コンファレンス2015, F111, 2015
  • 5) K. Yuki, K. Takai, et al.: “Proposal of utilizing uni-directional porous metal for extremely high heat flux removal,” Proceedings of the 6th International Conference on Porous Media and Its Applications in Science and Engineering, 2016
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