Art

J-GLOBAL ID：201802278150460608   Reference number：18A1919118

Fundamental Study on Cyclic Stress Measurement Under High Temperature Environment Using Nickel Alloy Foil

ニッケル合金薄膜を利用した高温繰返し応力測定法に関する基礎的研究

Author (3)： ONO YUICHI (鳥取大学大学院工学研究科) ,  NOMURA TAKEHIRO ((株)IHI要素技術部) ,  MORITO SHIGEKAZU (島根大学大学院総合理工学研究科)
Material： 実験力学  (JSEM)
Volume： 18  Issue： 3  Page： 176-183(J-STAGE)  Publication year： 2018 
JST Material Number： L4590A  ISSN： 1346-4930  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)

Thesaurus term： *stress strain characteristic ,  *stress measurement ,  *nickel plating ,  *electroplating ,  *electron diffraction ,  backward scattering ,  *nickel base alloy ,  *metallic thin film ,  repeated stress ,  *X-ray diffraction ,  *fatigue strength ,  alloy plating ,  crystal growth ,  crystal grain size ,  tensile test
Semi thesaurus term： *EBSD ,  alloy thin film ,  高温繰返し応力 ,  overheating test

Author keywords (10)： Stress-strain measurement ,  Nickel electroplating method ,  Fatigue ,  Electron back scatter diffraction ,  X-ray diffraction ,  Stress-strain measurement ,  Nickel electroplating method ,  Fatigue ,  Electron back scatter diffraction ,  X-ray diffraction

JST classification (3)： Measuring methods and instruments of force,work load,pressure,friction  (AD05050V) ,  Electroplating  (WC08023B) ,  Metallic materials  (HC05020S)

Reference (13)：

• 1) Ohkubo, H.: Copper Electroplating Method of Stress Analysis, Memoirs Fac. Eng. Nagoya Univ., 20-1 (1968), 1-156.
• 2) Kitaoka, S., Ono, Y. and Nakagawa, M.: Measurement of biaxial stress using grown grain density rate in electrodeposited copper foil with a microcircular Hole (in Japanese), Trans. Jpn. Soc. Mech. Eng., A69-679(2003), 565-570.
• 3) Kitaoka, S. and Ono, Y.: Biaxial stress measurement by electrodeposited copper foil with circular holes, Strain, 42-1(2006), 49-56.
• 4) Ono, Y., Morito, S. and Li, C.: Stress measurement using EBSD analysis of grains in copper foil, Exp. Mech., 52-5 (2012), 493-502.
• 5) Kato, A.: Fundamental study of copper electroplating method (in Japanese), Trans. Jpn. Soc. Mech. Eng., A 49-446 (1983), 1344-1349.

Terms in the title (5)： ニッケル ,  合金薄膜 ,  繰返し応力 ,  測定法 ,  基礎的研究