Rchr
J-GLOBAL ID:201901016915377261   Update date: Sep. 17, 2021

KOSHI Tomoya

コシ トモヤ | KOSHI Tomoya
Affiliation and department:
Job title: Research Scientist
Research field  (3): Machine materials and mechanics ,  Electric/electronic material engineering ,  Electronic devices and equipment
Research keywords  (7): Deformation ,  Crack ,  Fracture ,  Stretchable Interconnects ,  E-Textiles ,  Stretchable Electronics ,  Flexible Electronics
Research theme for competitive and other funds  (2):
  • 2021 - 2023 き裂発生形態の制御による布上印刷電子回路の高耐久化設計指針の構築
  • 2016 - 2019 自己修復型金属配線を用いた高機能・高伸縮耐性フレキシブルデバイス
Papers (15):
  • Tomoya Koshi, Ken-ichi Nomura, Manabu Yoshida. Measurement and analysis on failure lifetime of serpentine interconnects for e-textiles under cyclic large deformation. Flexible and Printed Electronics. 2021
  • Ken-ichi Nomura, Yoshinori Horii, Tomoya Koshi, Manabu Yoshida, Hirobumi Ushijima, Hiroyuki Matsuo, Takayuki Ouchida, Yoshiharu Kotsubo, Yuji Kurata. Fine pattern formation with solder paste using screen printing with stainless steel mesh-cut screen mask. Journal of Micromechanics and Microengineering. 2020. 30. 11. 115023-115023
  • Tomoya Koshi, Ken-ichi Nomura, Manabu Yoshida. Electrical Characterization of a Double-Layered Conductive Pattern with Different Crack Configurations for Durable E-Textiles【Selected for Feature Paper and Editor's Choice】. Micromachines. 2020. 11. 11. 977-977
  • Tomoya Koshi, Ken-ichi Nomura, Manabu Yoshida. Resistance Reduction of Conductive Patterns Printed on Textile by Curing Shrinkage of Passivation Layers. Micromachines. 2020. 11. 6. 539-539
  • Tomoya Koshi, Ken-ichi Nomura, Manabu Yoshida. Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns【Selected for Feature Paper】. Micromachines. 2020. 11. 2. 209-209
more...
MISC (4):
Patents (3):
  • 衣服及び解析システム
  • 電子部品付き基材及びその製造方法
  • Self-Repairing Wiring and Stretchable Device
Books (3):
  • Trend of Developments and Applications of Stretchable Electronics
    CMC Publishing CO.,LTD. 2021 ISBN:9784781316079
  • 自己修復材料、自己組織化、形状記憶材料の開発と応用事例
    技術情報協会 2020 ISBN:9784861047817
  • ウェアラブルデバイスの小型、薄型化と伸縮、柔軟性の向上技術
    技術情報協会 2015 ISBN:9784861046063
Lectures and oral presentations  (50):
  • Organic physically unclonable function for secure 2D code on e-paper
    (The International Conference on Flexible and Printed Electronics 2021 2021)
  • 電鋳メッシュスクリーン版によるコンデンサ内部電極の印刷形成
    (第31回マイクロエレクトロニクスシンポジウム 2021)
  • ファインピッチ印刷配線を用いた集積回路実装技術の開発
    (日本物理学会 2021年秋季大会 2021)
  • バスキーパー型物理的複製困難関数の熱安定性
    (第82回応用物理学会秋季学術講演会 2021)
  • Study on Laminated Structure of Stretchable Serpentine Interconnects for Wearable Devices and Its Application in Cloth Face Mask Type Device
    (第35回エレクトロニクス実装学会春季講演大会 2021)
more...
Education (3):
  • - 2019 Waseda University Department of Applied Mechanics, D.Eng.
  • - 2016 Waseda University Department of Applied Mechanics, M.Eng.
  • - 2014 Waseda Univercity Department of Applied Mechanics and Aerospace Engineering, B.Eng.
Professional career (1):
  • D.Eng. (Waseda University)
Work history (3):
  • 2019/04 - 現在 National Institute of Advanced Industrial Science and Technology (AIST) Sensing System Research Center (SSRC) Research Scientist
  • 2016/04 - 2019/03 Japan Society for the Promotion of Science (JSPS) Research Fellow (DC1)
  • 2017/04 - 2017/07 Fraunhofer IZM Research Scientist
Awards (7):
  • 2019/07 - FujiSankei Business i Special Prize, Grand Prize for Frontier Technology: Pave a New Way for Creativity
  • 2018/07 - Kansai Branch, The Japan Institute of Electronics Packaging (JIEP) Impact Poster Award, Kansai Workshop 2018
  • 2016/12 - Micro-Nano Science and Technology Division, The Japan Society of Mechanical Engineering (JSME) Micro-Nano Engineering Excellent Presentation Certificate of Merit
  • 2016/03 - The Japan Society of Mechanical Engineering (JSME) Miura Award
  • 2016/03 - Waseda University Azusa Ono Memorial Award for Academic Studies
Show all
Association Membership(s) (1):
The Japan Institute of Electronics Packaging
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