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J-GLOBAL ID：201902010624035725   Reference number：19S2707631

A New Face Down Bonding Technique Using a Low Melting Point Metal

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Author (5)：
Mori, Miki

About Mori, Miki

(Research and Development Center, Toshiba Corporation)

About Research and Development Center, Toshiba Corporation

, 
Saito, Masayuki

About Saito, Masayuki

(Research and Development Center, Toshiba Corporation)

About Research and Development Center, Toshiba Corporation

, 
Hongu, Akinori

About Hongu, Akinori

(Research and Development Center, Toshiba Corporation)

About Research and Development Center, Toshiba Corporation

, 
Niitsuma, Akira

About Niitsuma, Akira

(Research and Development Center, Toshiba Corporation)

About Research and Development Center, Toshiba Corporation

, 
Ohdaira, Hiroshi

About Ohdaira, Hiroshi

(Electronic Package and Assembly Development Center, Toshiba Corporation)

About Electronic Package and Assembly Development Center, Toshiba Corporation


Material：
IEEE Transactions on Components, Hybrids, and Manufacturing Technology

About IEEE Transactions on Components, Hybrids, and Manufacturing Technology


Volume： 13  Issue： 2  Page： 444-447  Publication year： 1990 
JST Material Number： SCOPUS  ISSN： 0148-6411 
Language： English (EN)
Terms in the title (1)：
Terms in the title
Keywords automatically extracted from the title.
FACE

About FACE


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