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J-GLOBAL ID：201902113784398453   Reference number：19S2867967

High-reliability interconnection formation by a two-step switching bias sputtering process

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Author (3)：
Onuki, Jin

About Onuki, Jin

(Hitachi Research Laboratory, Hitachi Ltd.)

About Hitachi Research Laboratory, Hitachi Ltd.

, 
Nihei, Masayasu

About Nihei, Masayasu

(Hitachi Research Laboratory, Hitachi Ltd.)

About Hitachi Research Laboratory, Hitachi Ltd.

, 
Koizumi, Masahiro

About Koizumi, Masahiro

(Hitachi Research Laboratory, Hitachi Ltd.)

About Hitachi Research Laboratory, Hitachi Ltd.


Material：
Thin Solid Films

About Thin Solid Films


Volume： 266  Issue： 2  Page： 182-188  Publication year： 1995 
JST Material Number： SCOPUS  ISSN： 0040-6090  CODEN： THSFA 
Language： English (EN)

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