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J-GLOBAL ID：201902205230140049   Reference number：19S0381861

Design review on capacitive coupling interconnect for 3DIC

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Author (4)：
Aung, Myat Thu Linn

About Aung, Myat Thu Linn

(VIRTUS, School of EEE, Nanyang Technological University)

About VIRTUS, School of EEE, Nanyang Technological University

, 
Kim, Tony Tae-Hyoung

About Kim, Tony Tae-Hyoung

(VIRTUS, School of EEE, Nanyang Technological University)

About VIRTUS, School of EEE, Nanyang Technological University

, 
Lim, Eric

About Lim, Eric

(Panasonic Semiconductor)

About Panasonic Semiconductor

, 
Yoshikawa, Takefumi

About Yoshikawa, Takefumi

(Mixed-signal Technology Development Division, Panasonic Corporation)

About Mixed-signal Technology Development Division, Panasonic Corporation


Material：
Proceedings of the 2015 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2015

About Proceedings of the 2015 IEEE International Conference on Electron Devices and Solid-State Circuits, EDSSC 2015


Page： 245-248  Publication year： 2015 
JST Material Number： SCOPUS  ISBN： 9781479983636 
Country of issue： United States (USA)  Language： English (EN)
Terms in the title (1)：
Terms in the title
Keywords automatically extracted from the title.
DESIGN

About DESIGN


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