Art

J-GLOBAL ID：201902206196131767   Reference number：19S1501300

Low temperature curing aqueous base developable photoimageable dielectric for wafer level packaging

Author (9)： Huenger, Eric (Dow Electronic Materials) ,  Lachowski, Joe (Dow Electronic Materials) ,  Prokopowicz, Greg (Dow Electronic Materials) ,  Thibault, Ray (Dow Electronic Materials) ,  Gallagher, Michael (Dow Electronic Materials) ,  Lnaoka, Seiji (Dow Electronic Materials) ,  Kisting, Scott (Dow Electronic Materials) ,  Mills, Lynne (Dow Electronic Materials) ,  Kondoh, Masaki (Dow Electronic Materials)
Material： IMAPS International Conference and Exhibition on Device Packaging, DPC 2012 - In Conjunction with the Global Business Council, GBC 2012 Spring Conference
Page： 986-1015  Publication year： 2012 
JST Material Number： SCOPUS 
Country of issue： United States (USA)  Language： English (EN)