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J-GLOBAL ID：201902206453496186   Reference number：19S1346431

Effects of post-etching treatment (PET) on molecular-pore-stacking (MPS)/Cu interconnects for 28 nm-node and beyond

Author (11)： Oshida, Daisuke (Renesas Electronics Corporation) ,  Kume, I. (Renesas Electronics Corporation) ,  Katsuyama, H. (Renesas Electronics Corporation) ,  Taiji, T. (Renesas Electronics Corporation) ,  Maruyama, T. (Renesas Electronics Corporation) ,  Ueki, M. (Renesas Electronics Corporation) ,  Inoue, N. (Renesas Electronics Corporation) ,  Iguchi, M. (Renesas Electronics Corporation) ,  Fujii, K. (Renesas Electronics Corporation) ,  Oda, N. (Renesas Electronics Corporation) ,  Sakurai, M. (Renesas Electronics Corporation)
Material： Advanced Metallization Conference (AMC)
Page： 103-104  Publication year： 2010 
JST Material Number： SCOPUS  ISSN： 1540-1766  ISBN： 9781617822810  CODEN： MRSPD 
Country of issue： United States (USA)  Language： English (EN)

Terms in the title (3)： PET ,  MPS ,  Cu