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J-GLOBAL ID：201902210096555753   Reference number：19S1068899

Study on copper thin films deposited onto titanium nitride layer for ultra-large scale integration

Author (4)： Kim, M. C. (Dept. of Electronic Engineering, Sunmoon University) ,  Cho, N. I. (Dept. of Electronic Engineering, Sunmoon University) ,  Jun, K. Y. (Dept. of Metallurgy, University of Tokyo) ,  Shimogaki, Y. (Dept. of Metallurgy, University of Tokyo)
Material： Advanced Metallization Conference (AMC)
Page： 237-241  Publication year： 2003 
JST Material Number： SCOPUS  ISSN： 1540-1766  CODEN： MRSPD 
Country of issue： United States (USA)  Language： English (EN)

Terms in the title (1)： SCALE