Art

J-GLOBAL ID：201902212008020590   Reference number：19A0011941

Improvement of adhesion of hydrogen-free DLC film by employing an interlayer of tungsten carbide

炭化タングステン中間層を用いた水素フリーDLC膜の密着性の改善【JST・京大機械翻訳】

Author (11)： Isono Ryo (Toyohashi University of Technology, 1-1 Hibarigaoka, Tempaku, Toyohashi, 441-8580, Japan) ,  Tanimoto Tsuyoshi (Toyohashi University of Technology, 1-1 Hibarigaoka, Tempaku, Toyohashi, 441-8580, Japan) ,  Iijima Yushi (Toyohashi University of Technology, 1-1 Hibarigaoka, Tempaku, Toyohashi, 441-8580, Japan) ,  Kusumawan Sholihatta Aziz (Toyohashi University of Technology, 1-1 Hibarigaoka, Tempaku, Toyohashi, 441-8580, Japan) ,  Harigai Toru (Toyohashi University of Technology, 1-1 Hibarigaoka, Tempaku, Toyohashi, 441-8580, Japan) ,  Suda Yoshiyuki (Toyohashi University of Technology, 1-1 Hibarigaoka, Tempaku, Toyohashi, 441-8580, Japan) ,  Takikawa Hirofumi (Toyohashi University of Technology, 1-1 Hibarigaoka, Tempaku, Toyohashi, 441-8580, Japan) ,  Kamiya Masao (Itoh Optical Industrial Co., Ltd., 3-19, Miyanari, Gamagori, 443-0041, Japan) ,  Kaneko Satoru (Kanagawa Institute of Industrial Science and Technology, 705-1, Shimoimaizumi, Ebina, 243-0435, Japan) ,  Kunitsugu Shinsuke (Industrial Technology Center of Okayama Prefecture, 5301, Haga, Kitaku, Okayama, 701-1296, Japan) ,  Taki Makoto (Onward Ceramic Coating Co., Ltd., 13, Yoshiwara, Nomi, 929-0111, Japan)
Material： AIP Conference Proceedings  (AIP Conf Proc)
Volume： 1929  Issue： 1  Page： 020019-020019-7  Publication year： 2018 
JST Material Number： D0071C  ISSN： 0094-243X  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)

Abstract/Point： Materials with poor adhesion p...

Register(free) or Log In to access     To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=19A0011941&from=J-GLOBAL&jstjournalNo=D0071C") }}

Thesaurus term： *DLC film ,  *adhesion property ,  morphology (form) ,  oxidized layer ,  adhesion (bond) ,  substrate (plate) ,  peeling test ,  cathode ,  film thickness ,  cemented carbide ,  *tungsten carbide ,  binding agent (admixture) ,  electric discharge ,  *interlayer
Semi thesaurus term： バイアス電圧 , 【Automatic Indexing@JST】

JST classification (2)： Carbon and its compounds  (YB02060D) ,  Thin films of other inorganic compounds  (BK14060A)

Terms in the title (5)： 炭化タングステン ,  中間層 ,  水素 ,  DLC膜 ,  密着性