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J-GLOBAL ID：201902219268581449   Reference number：19S2166916

Effect of mechanical surface damage on silicon wafer strength

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Author (4)：
Echizenya, Daisuke

About Echizenya, Daisuke

(Mitsubishi Electric Corporation)

About Mitsubishi Electric Corporation

, 
Echizenya, Daisuke

About Echizenya, Daisuke

(Hokkaido University)

About Hokkaido University

, 
Sakamoto, Hiroo

About Sakamoto, Hiroo

(Mitsubishi Electric Corporation)

About Mitsubishi Electric Corporation

, 
Sasaki, Katsuhiko

About Sasaki, Katsuhiko

(Hokkaido University)

About Hokkaido University


Material：
Procedia Engineering

About Procedia Engineering


Volume： 10  Page： 1440-1445  Publication year： 2011 
JST Material Number： SCOPUS  ISSN： 1877-7058 
Country of issue： United Kingdom (GBR)  Language： English (EN)

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