Art
J-GLOBAL ID:201902288761982706   Reference number:19A2329916

Bonding and High-Temperature Storage Performance of Die Attachment with Ag Paste Sintering on Bare DBA Substrate

DBA基板アルミ表面に直接接合した焼結銀ダイアタッチの熱劣化特性と信頼性評価
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Material:
Volume: 29th  Page: 189-192  Publication year: Sep. 12, 2019 
JST Material Number: X0060A  ISSN: 2434-396X  Document type: Proceedings
Article type: 原著論文  Country of issue: Japan (JPN)  Language: ENGLISH (EN)
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All keywords is available on JDreamIII(charged).
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Category name(code) classified by JST.
Manufacturing technology of solid-state devices  ,  Measurement,testing and reliability of solid-state devices 

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