Rchr
J-GLOBAL ID:202001016982268001   Update date: Jul. 02, 2022

Kibushi Risako

キブシ リサコ | Kibushi Risako
Affiliation and department:
Research field  (2): Electronic devices and equipment ,  Thermal engineering
Research keywords  (2): Power electronics ,  Thermal engineering
Research theme for competitive and other funds  (1):
  • 2018 - 2022 Formulation of multiscale thermal model in SiC power semiconductor device
Papers (73):
  • Risako Kibushi, Kazuhisa Yuki, Noriyuki Unno, Shigeru Tanaka, Kazuyuki Hokamoto. Heat transfer and pressure drop correlations for a gas flow in unidirectional porous copper tubes. International Journal of Heat and Mass Transfer. 2022. 195. 123123-123123
  • Kazuhisa Yuki, Risako Kibushi, Ryohei Kubota, Noriyuki Unno, Shigeru Tanaka, Kazuyuki Hokamoto. Heat Transfer Potential of Unidirectional Porous Tubes for Gas Cooling under High Heat Flux Conditions. Energies. 2022. 15. 3. 1042-1042
  • Risako Kibushi, Kazuhisa Yuki, Noriyuki Unno, Tetsuro Ogushi, Masaaki Murakami, Tomiyuki Numata, Takuya Ide, Hikaru Nomura. Enhancement of the critical heat flux of saturated pool boiling by the breathing phenomenon induced by lotus copper in combination with a grooved heat transfer surface. International Journal of Heat and Mass Transfer. 2021. 179
  • Tomoyuki Hatakeyama, Risako Kibushi, Yoshiki Hyodo, Masaru Ishizuka. Prediction of thermal contact resistance for thermal design of electronics. Journal of Japan Institute of Electronics Packaging. 2021. 24. 2. 174-177
  • Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Koichi Suzuki. Low Pressure Subcooled Boiling in a Compact Vessel for Cooling Technology. 2021 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2021). 2021. 1-2
more...
MISC (27):
  • T. Hatakeyama, R. Kibushi, K. Suzuki, M. Ishizuka. Thermal Network Analysis for Heat Dissipation Performance of Printed Circuit Board Using JPCA Methoda. 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT2019). 2019
  • Tsuji Rikako, Kazuhisa Yuki, Kio Takai, Risako Kibushi, Noriyuki Unno, Takuya Ide Tetsuro Ogushi, Masaaki Murakami, Tomiyuki Numata, Hikaru Nomura. Two-Phase Immersion Cooling of a SiC on-Vehicle Inverter by Self-Cooling Effect Using Lotus Porous Coppers. International Technical Conference and Packaging and Integration of Electronic and Photonic Microsystems (Inter PACK). 2019
  • R. Kibushi, K. Yuki, N. Unno, K. Yuki, T. Tomimura, T. Hatakeyama, M. Ishizuka. Thermal resistance evaluation in high heat flux electronics. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). 2018
  • Y. Hyodo, T. Hatakeyama, R. Kibushi, M. Ishizuka. Measurement of thermal and electrical contact resistance between conductive materials. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). 2018
  • 兵藤文紀, 畠山友行, 木伏理沙子, 石塚勝. Evaluation of the Contact Thermal Resistance Using Numerical Analysis. 日本機械学会熱工学コンファレンス講演論文集(CD-ROM). 2018. 2018
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Books (1):
  • サーマルデバイス : 新素材・新技術による熱の高度制御と高効率利用
    エヌ・ティー・エス 2019 ISBN:9784860436025
Lectures and oral presentations  (80):
  • 一方向性気孔構造を有するポーラス型熱交換器の熱伝達および圧力損失相関式の構築
    (第57回日本伝熱シンポジウム 2020)
  • 定常法を用いた接触熱抵抗計測における熱損失と測定精度の関係
    (第57回日本伝熱シンポジウム 2020)
  • 低接触圧領域におけるBMR2の接触熱抵抗の評価
    (第57回日本伝熱シンポジウム 2020)
  • 高熱流束環境における接触熱抵抗モデル化のための数値解析
    (第57回日本伝熱シンポジウム 2020)
  • ブリージング現象制御による沸騰浸漬冷却の限界熱流束促進
    (第57回日本伝熱シンポジウム 2020)
more...
Work history (2):
  • 2021/04 - Toyama Prefectural University
  • 2016/04 - 2021/03 Tokyo University of Science,Yamaguchi
Committee career (10):
  • 2020 - 現在 実装学会 サーマルマネージメント研究会幹事
  • 2016 - 現在 Pacific Center of Thermal Fluids Engineering (PCTFE) 実行委員
  • 2020 - 2020 Pacific Center of Thermal Fluids Engineering (PCTFE) Executive Committee of The 31st International Symposium on Transport Phenomena, 2020 (ISTP31)
  • 2019 - 2019 Pacific Center of Thermal Fluids Engineering (PCTFE) [5] International Scientific Committee of The 30st International Symposium on Transport Phenomena, 2019 (ISTP30)
  • 2018 - 2019 日本機械学会 分科会RC278「新時代の電子デバイスと電子機器における信頼性評価と熱設計に関する研究分科会
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Awards (3):
  • 2016 - IEEE IEEE CPMT Japan Chapter Young Award of ICEP-IAAC 2015
  • 2013 - IMPACT Outstanding Paper Award 2013 Best Student Paper Special Prize
  • 2011 - ASME First Prize in the 4th ASME English Presentation Competition for Japanese Students and Young Engineer
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