Rchr
J-GLOBAL ID:202001016982268001   Update date: Aug. 30, 2020

Kibushi Risako

キブシ リサコ | Kibushi Risako
Affiliation and department:
Job title: 助教
Research field  (2): Electronic devices and equipment ,  Thermal engineering
Research keywords  (2): Power electronics ,  Thermal engineering
Research theme for competitive and other funds  (1):
  • 2018 - 2022 Formulation of multiscale thermal model in SiC power semiconductor device
Papers (60):
  • Kazuhisa YUKI, Risako KIBUSHI, Rikako TSUJI, Kio TAKAI, Noriyuki UNNO, Tetsuro OGUSHI, Masaaki MURAKAMI, Tomiyuki NUMATA, Hikaru NOMURA, Takuya IDE. Thermal management of automotive SiC-based on-board inverter with 500 W/cm2 in heat flux, and Two-phase immersion cooling by breathing phenomenon spontaneously induced by lotus porous copper jointed onto a grooved heat transfer surface. Journal of Thermal Science and Technology. 2020. 15. 1. JTST0012-JTST0012
  • NIWA Hayato, KIBUSHI Risako, UNNO Noriyuki, YUKI Kazuhisa. Evaluation of Contact Thermal Resistance of Ag Paste under High Heat Flux Conditions. The Proceedings of Mechanical Engineering Congress, Japan. 2019. 2019. 0. J01104P
  • Shiraishi Takeki, KIBUSHI Risako, UNNO Noriyuki, YUKI Kazuhisa. Heat Transfer Characteristics of Multi-Nozzle Impinge Jets with Outlet Slits. The Proceedings of the National Symposium on Power and Energy Systems. 2019. 2019. 0. A212
  • Y.Hyodo, T. Hatakeyama, R. Kibushi, M.Ishizuka. Evaluation of Contact Thermal Resistance in Low Contact Pressure Region -comparison of Experiment, Numerical Analysis and Predictive Formula. Proceedings of The 30th International Symposium on Transport Phenomena (ISTP30). 2019
  • Risako Kibushi, Tomoyuki Hatakeyama, Yoshiki Hyodo, Kazuhisa Yuki, Noriyuki Unno, Masaru Ishizuka, Toshio Tomimura. Evaluation of Thermal Contact Resistance Under High Heat Flow Considering Thermal Expansion Using Numerical Analysis. Proceedings of The 30th International Symposium on Transport Phenomena (ISTP30). 2019
more...
MISC (27):
  • T. Hatakeyama, R. Kibushi, K. Suzuki, M. Ishizuka. Thermal Network Analysis for Heat Dissipation Performance of Printed Circuit Board Using JPCA Methoda. 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT2019). 2019
  • Tsuji Rikako, Kazuhisa Yuki, Kio Takai, Risako Kibushi, Noriyuki Unno, Takuya Ide Tetsuro Ogushi, Masaaki Murakami, Tomiyuki Numata, Hikaru Nomura. Two-Phase Immersion Cooling of a SiC on-Vehicle Inverter by Self-Cooling Effect Using Lotus Porous Coppers. International Technical Conference and Packaging and Integration of Electronic and Photonic Microsystems (Inter PACK). 2019
  • R. Kibushi, K. Yuki, N. Unno, K. Yuki, T. Tomimura, T. Hatakeyama, M. Ishizuka. Thermal resistance evaluation in high heat flux electronics. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). 2018
  • Y. Hyodo, T. Hatakeyama, R. Kibushi, M. Ishizuka. Measurement of thermal and electrical contact resistance between conductive materials. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). 2018
  • Y. Abe, K. Yuki, Y. Sato, R. Kibushi, N. Unno, T. Tomimura,. 2018
more...
Books (1):
  • サーマルデバイス : 新素材・新技術による熱の高度制御と高効率利用
    エヌ・ティー・エス 2019 ISBN:9784860436025
Lectures and oral presentations  (80):
  • 一方向性気孔構造を有するポーラス型熱交換器の熱伝達および圧力損失相関式の構築
    (第57回日本伝熱シンポジウム 2020)
  • 定常法を用いた接触熱抵抗計測における熱損失と測定精度の関係
    (第57回日本伝熱シンポジウム 2020)
  • 低接触圧領域におけるBMR2の接触熱抵抗の評価
    (第57回日本伝熱シンポジウム 2020)
  • 高熱流束環境における接触熱抵抗モデル化のための数値解析
    (第57回日本伝熱シンポジウム 2020)
  • ブリージング現象制御による沸騰浸漬冷却の限界熱流束促進
    (第57回日本伝熱シンポジウム 2020)
more...
Professional career (1):
  • 博士(工学) (富山県立大学)
Committee career (10):
  • 2020 - 現在 実装学会 サーマルマネージメント研究会幹事
  • 2016 - 現在 Pacific Center of Thermal Fluids Engineering (PCTFE) 実行委員
  • 2020 - 2020 Pacific Center of Thermal Fluids Engineering (PCTFE) Executive Committee of The 31st International Symposium on Transport Phenomena, 2020 (ISTP31)
  • 2019 - 2019 Pacific Center of Thermal Fluids Engineering (PCTFE) [5] International Scientific Committee of The 30st International Symposium on Transport Phenomena, 2019 (ISTP30)
  • 2018 - 2019 日本機械学会 分科会RC278「新時代の電子デバイスと電子機器における信頼性評価と熱設計に関する研究分科会
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Awards (3):
  • 2016 - IEEE IEEE CPMT Japan Chapter Young Award of ICEP-IAAC 2015
  • 2013 - IMPACT Outstanding Paper Award 2013 Best Student Paper Special Prize
  • 2011 - ASME First Prize in the 4th ASME English Presentation Competition for Japanese Students and Young Engineer
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