Art

J-GLOBAL ID：202002221187602932   Reference number：20A0601848

Thick Copper Wiring on Liquid Crystal Polymer Substrate by Nd:YVO₄ Green Laser Irradiation

Nd:YVO₄グリーンレーザを用いた液晶高分子基板への銅厚膜配線形成

Author (5)： SONODA HISAYA (アルファジャパン) ,  OHASHI SHOTA (茨城大 大学院理工学研究科) ,  MITA MAMORU (M&M研究所) ,  MAEKAWA KATSUHIRO (M&M研究所) ,  YAMASAKI KAZUHIKO (茨城大 大学院理工学研究科)
Material： レーザ加工学会誌  (Journal of Japan Laser Processing Society)
Volume： 27  Issue： 1  Page： 42-49  Publication year： Feb. 2020 
JST Material Number： L3905A  ISSN： 1881-6797  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)

Thesaurus term： wiring ,  thick film ,  visible laser ,  solid-state laser ,  liquid crystal polymer ,  fine particle ,  paste ,  absorption coefficient ,  effect ,  film thickness ,  electrical resistivity ,  electrostatic capacity ,  Electronics ,  surface structure ,  *green laser ,  anchor effect ,  interface structure ,  *selective laser sintering ,  Adhesiveness ,  structure ,  *sintering ,  *heat treatment ,  *treatment
Semi thesaurus term： *laser sintering ,  *copper interconnect ,  Nd:YVO4 laser ,  liquid crystal polymer ,  micro particle ,  conductive paste ,  Light absorption rate ,  adhesiveness ,  resistivity ,  printed electronics

JST classification (2)： Manufacturing technology of solid-state devices  (NC03030V) ,  Applications of lasers  (BD04100V)

Reference (18)：

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Terms in the title (6)： Nd ,  グリーンレーザ ,  液晶 ,  高分子基板 ,  銅 ,  厚膜