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J-GLOBAL ID：202002236746349268   Reference number：20A0329972

Mechanical characteristics and fracture behavior of GaN/DBA die-attached during thermal aging: pressure-less hybrid Ag sinter joint and Pb-5Sn solder joint

熱時効中のGaN/DBAダイ付着の機械的特性と破壊挙動 無圧力ハイブリッドAg焼結継手とPb-5Snはんだ接合【JST・京大機械翻訳】

Author (5)： Kim Dongjin (Department of Adaptive Machine Systems, Graduate School of Engineering, Osaka University, Suita-shi, Osaka, Japan) ,  Kim Dongjin (The Institute of Scientific and Industrial Research, Osaka University, Ibaraki-shi, Osaka, Japan) ,  Chen Chuantong (The Institute of Scientific and Industrial Research, Osaka University, Ibaraki-shi, Osaka, Japan) ,  Nagao Shijo (The Institute of Scientific and Industrial Research, Osaka University, Ibaraki-shi, Osaka, Japan) ,  Suganuma Katsuaki (The Institute of Scientific and Industrial Research, Osaka University, Ibaraki-shi, Osaka, Japan)
Material： Journal of Materials Science. Materials in Electronics  (J Mater Sci Mater Electron)
Volume： 31  Issue： 1  Page： 587-598  Publication year： 2020 
JST Material Number： W0003A  ISSN： 0957-4522  CODEN： JMTSAS  Document type： Article
Article type： 原著論文  Country of issue： Germany, Federal Republic of (DEU)  Language： ENGLISH (EN)

Abstract/Point： Abstract: Ag sinter joining pr...

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Thesaurus term： oxidation ,  *solder ,  *soldering ,  semiconductor device ,  adhesive ,  reliability(property) ,  high temperature ,  shear strength ,  *aging(phenomenon) ,  *silver ,  interface(surface) ,  dielectrics ,  intermetallic compound ,  *sintering ,  pressurization

JST classification (2)： Connecting parts  (NA05050Z) ,  Materials of solid-state devices  (NC03020K)

Terms in the title (12)： 熱時効 ,  GaN ,  DBA ,  ダイ ,  機械的特性 ,  破壊挙動 ,  無圧力 ,  Ag ,  焼結 ,  継手 ,  Pb ,  はんだ接合