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J-GLOBAL ID：202002241861220761   Reference number：20A0269067

Functional Printing of MMIC-Interconnects on LTCC Packages for sub-THz applications

サブTHz応用のためのLTCCパッケージ上のMMIC相互接続の機能的印刷【JST・京大機械翻訳】

Author (4)： Ihle Martin (Fraunhofer Institute for Ceramic Technologies and Systems IKTS,Dresden,Germany) ,  Ziesche Steffen (Fraunhofer Institute for Ceramic Technologies and Systems IKTS,Dresden,Germany) ,  Zech Christian (Fraunhofer Institute for Applied Solid State Physics,Freiburg) ,  Baumann Benjamin (Fraunhofer Institute for Applied Solid State Physics,Freiburg)
Material： IEEE Conference Proceedings  (IEEE Conf Proc)
Volume： 2019  Issue： EMPC  Page： 1-4  Publication year： 2019 
JST Material Number： W2441A  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)

Abstract/Point： In this paper, the authors pre...

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Thesaurus term： dielectrics ,  insertion loss ,  low temperature ,  printed wiring ,  reflectivity ,  *printing (graphic arts) ,  printer ,  *interconnection ,  transmission line ,  ink ,  interface (surface) ,  *MMIC ,  adhesion (surface chemistry) ,  gallium arsenide ,  conductive property

JST classification (5)： Manufacturing technology of solid-state devices  (NC03030V) ,  Mobile communication  (ND08030H) ,  Signal theory  (ND02020G) ,  Measurement,testing and reliability of solid-state devices  (NC03040G) ,  Graphic and image processing in general  (JE04010I)

Terms in the title (6)： サブ ,  応用 ,  LTCC ,  パッケージ ,  MMIC ,  相互接続