Art
J-GLOBAL ID：202002242885942838   Reference number：20A1751298

Electro-migration evaluation between organic interposer and build-up substrate on 2.3D organic package

2.3D有機パッケージ上の有機インターポーザとビルドアップ基板間のエレクトロマイグレーション評価【JST・京大機械翻訳】
Author (4)：
Murayama Kei

About Murayama Kei

(Shinko Electric Industries Co., LTD.,Process Development Dept.,Nagano-shi,Japan)

About Shinko Electric Industries Co., LTD.,Process Development Dept.,Nagano-shi,Japan

, 
Miki Shota

About Miki Shota

(Shinko Electric Industries Co., LTD.,Process Development Dept.,Nagano-shi,Japan)

About Shinko Electric Industries Co., LTD.,Process Development Dept.,Nagano-shi,Japan

, 
Sugahara Hiromi

About Sugahara Hiromi

(Shinko Electric Industries Co., LTD.,Designing Technology Development Dept.,Nagano-shi,Japan)

About Shinko Electric Industries Co., LTD.,Designing Technology Development Dept.,Nagano-shi,Japan

, 
Oi Kiyoshi

About Oi Kiyoshi

(Shinko Electric Industries Co., LTD.,Process Development Dept.,Nagano-shi,Japan)

About Shinko Electric Industries Co., LTD.,Process Development Dept.,Nagano-shi,Japan


Material：
IEEE Conference Proceedings  (IEEE Conf Proc)

About IEEE Conference Proceedings


Volume： 2020  Issue： ECTC  Page： 716-722  Publication year： 2020 
JST Material Number： W2441A  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)
Abstract/Point：
Abstract/Point
Japanese summary of the article(about several hundred characters).
All summary is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
In recent years, 2.3D packages...
Register(free) or Log In to access 

Please login to MyJ-GLOBAL to see full information. You also need to select "Display abstract, etc. of medical articles" in your MyJ-GLOBAL account page in order to see abstracts, etc. of medical articles.

   To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=20A1751298&from=J-GLOBAL&jstjournalNo=W2441A") }}
Thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
interface(surface)

About interface(surface)

, 
intermetallic compound

About intermetallic compound

, 
segregation(concentration distribution)

About segregation(concentration distribution)

, 
tin

About tin

, 
bismuth

About bismuth

, 
soldering

About soldering

, 
melting point

About melting point

, 
current density

About current density

, 
liquid phase

About liquid phase

, 
solder

About solder

, 
flip chip method

About flip chip method

, 
*electromigration

About electromigration

, 
anode

About anode


Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
電子流

About 電子流

, 
*インターポーザ

About インターポーザ

, 【Automatic Indexing@JST】
JST classification (1)：
JST classification
Category name(code) classified by JST.
Graphic and image processing in general 
(JE04010I)

About Graphic and image processing in general

Terms in the title (6)：
Terms in the title
Keywords automatically extracted from the title.
3D

About 3D

, 
パッケージ

About パッケージ

, 
インターポーザ

About インターポーザ

, 
ビルドアップ基板

About ビルドアップ基板

, 
エレクトロマイグレーション

About エレクトロマイグレーション

, 
評価

About 評価


Return to Previous Page

TOP

BOTTOM