About Li Zhiwen
About Packaging R&D Nexperia HK Ltd.,Hong Kong,China
About Chen Haibin
About Mechanical and Aerospace Engineering Hong Kong University of Science and Technology,Hong Kong,China
About Fan Haibo
About Packaging R&D Nexperia HK Ltd.,Hong Kong,China
About Yang Jun
About Mechanical and Aerospace Engineering Hong Kong University of Science and Technology,Hong Kong,China
About IEEE Conference Proceedings
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About inductance
About interface(surface)
About crack
About optimization
About automobile
About reliability(property)
About electric power
About lead
About heat cycle
About silicon
About soldering
About moisture
About wire bonding
About solder
About printed board
About Graphic and image processing in general
About 熱サイクル
About はんだ接合
About ロバスト性
About 強化
About 成形コンパウンド
About 最適化