Art

J-GLOBAL ID：202002255176762414   Reference number：20A0108437

Dependence of Vickers Hardness on Layer Thickness in Electrodeposited Ni-Co-Cu/Cu Multilayered Films

電着Ni-Co-Cu/Cu多層膜における層厚さに対するVickers硬度の依存性

Author (4)： Hagiwara Hiroyuki (Department of Mechanical Engineering, Osaka City University) ,  Kawakami Naofumi (Department of Mechanical Engineering, Osaka City University) ,  Kaneko Yoshihisa (Department of Mechanical Engineering, Osaka City University) ,  Uchida Makoto (Department of Mechanical Engineering, Osaka City University)
Material： Materials Transactions  (Mater Trans)
Volume： 60  Issue： 12  Page： 2569-2575(J-STAGE)  Publication year： 2019 
JST Material Number： G0668A  ISSN： 1345-9678  Document type： Article
Article type： 原著論文  Country of issue： Japan (JPN)  Language： ENGLISH (EN)

Thesaurus term： electrodeposition ,  *nickel base alloy ,  cobalt containing alloy ,  copper containing alloy ,  Copper ,  multilayer film ,  thickness of strata ,  *indentation hardness ,  mismatch dislocation ,  X-Ray Diffraction

Author keywords (4)： multilayered film ,  nanostructured material ,  electrodeposition ,  hardness

JST classification (2)： Electroplating  (WC08023B) ,  Mechanical properties  (WB02030U)

Reference (35)：

• 1) Y. Iwahashi, Z. Horita, M. Nemoto and T.G. Langdon: Acta Mater. 46 (1998) 3317-3331.
• 2) R.Z. Valiev, R.K. Islamgaliev and I.V. Alexandrov: Prog. Mater. Sci. 45 (2000) 103-189.
• 3) S. Menezes and D.P. Anderson: J. Electrochem. Soc. 137 (1990) 440-444.
• 4) D.M. Tench and J.T. White: J. Electrochem. Soc. 138 (1991) 3757-3758.
• 5) D. Josell, D. van Heerden, D. Read, J. Bonevich and D. Shechtman: J. Mater. Res. 13 (1998) 2902-2909.

Terms in the title (8)： 電着 ,  Ni ,  CO ,  Cu ,  多層膜 ,  層厚 ,  Vickers硬度 ,  依存性