Art

J-GLOBAL ID：202002257378214293   Reference number：20A0423688

Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates

異なるSnベースの鉛フリーはんだ合金とCuNi基板との間の界面反応【JST・京大機械翻訳】

Author (6)： Razak Nurul Razliana Abdul (Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, QLD 4072, Australia) ,  Razak Nurul Razliana Abdul (Faculty of Engineering Technology, Universiti Malaysia Perlis, Kampus UniCITI Alam, Sungai Chuchuh, 02100 Padang Besar, Perlis, Malaysia) ,  Razak Nurul Razliana Abdul (Centre of Excellence Geopolymer and Green Technology, School of Materials Engineering, Universiti Malaysia Perlis, Taman Muhibbah, 02600 Jejawi, Arau, Perlis, Malaysia) ,  Tan Xin Fu (Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, QLD 4072, Australia) ,  McDonald Stuart D. (Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, QLD 4072, Australia) ,  Nogita Kazuhiro (Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, QLD 4072, Australia)
Material： IOP Conference Series: Materials Science and Engineering
Volume： 701  Issue： 1  Page： 012008 (5pp)  Publication year： 2019 
JST Material Number： W5559A  ISSN： 1757-8981  Document type： Article
Article type： 原著論文  Country of issue： United Kingdom (GBR)  Language： ENGLISH (EN)

Abstract/Point： The effect of the presence of ...

Register(free) or Log In to access     To see more with JDream III (charged).   {{ this.onShowAbsJLink("http://jdream3.com/lp/jglobal/index.html?docNo=20A0423688&from=J-GLOBAL&jstjournalNo=W5559A") }}

Thesaurus term： *tin ,  *Nickel ,  soldering ,  intermetallic compound ,  micro structure ,  reflow soldering ,  *alloy ,  *Copper ,  retention time ,  *interfacial reaction ,  *Pb free solder

JST classification (2)： Connecting parts  (NA05050Z) ,  Brazing  (WC07050C)

Terms in the title (4)： Sn ,  鉛フリー ,  はんだ合金 ,  界面反応