Art

J-GLOBAL ID：202002261037193599   Reference number：20A0467344

In,Znの微量添加によるSn-Bi合金の機械的特性改善

Author (5)： HIRATA YUKI (大阪大 大学院) ,  ZHOU Shiqi (大阪大 大学院) ,  YANG Chih-Han (国立成功大) ,  LIN Shin-Kang (国立成功大) ,  NISHIKAWA HIROSHI (大阪大 接合科研)
Material： Symposium on Microjoining and Assembly Technology in Electronics  (Proceedings of the Symposium on Microjoining and Assembly Technology in Electronics)
Volume： 26th  Page： 379-380  Publication year： Jan. 28, 2020 
JST Material Number： L2496A  Document type： Proceedings
Article type： 短報  Country of issue： Japan (JPN)  Language： JAPANESE (JA)

Thesaurus term： solder ,  *tin base alloy ,  bismuth containing alloy ,  indium additive alloy ,  zinc additive alloy ,  metal structure(microstructure) ,  *mechanical property ,  tensile strength ,  elongation percentage ,  aging treatment ,  lamellar structure
Semi thesaurus term： Pb free solder ,  *microstructure ,  lamellar structure

JST classification (3)： Brazing  (WC07050C) ,  Structural hardening phenomena  (WB01020C) ,  Mechanical properties  (WB02030U)

Reference (3)：

• O. Mokhtari, H. Nishikawa,“Correlation between microstructure and mechanical properties of Sn-Bi-X solders”, Materials Science and Engineering: A, Vol. 651, Jan. 2016, pp831-839.
• S. Zhou, C. Yang, et al,“The newly developed Sn-Bi-Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength”, Materialia, Vol. 6, Jun. 2019.
• X. Chen, F. Xue, et al,“Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn-Bi based lead-free solder”, Journal of Alloys and Compounds, Vol. 633, Jun. 2015, pp377-383.

Terms in the title (5)： Zn ,  微量添加 ,  Sn ,  Bi合金 ,  機械的特性