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J-GLOBAL ID：202002269112660193   Reference number：20A0495767

Comparison of Cl effect on Au-Al and Cu-Al HTS and bHAST wire bond reliability performance

Au-Al及びCu-Al HTS及びBhastワイヤボンド信頼性性能に及ぼすCl効果の比較【JST・京大機械翻訳】

Author (9)： Bisheng Wang (Huawei Technologies Co Ltd,Shenzhen,China,518129) ,  Jinzhi Lois Liao (Wintech Nano-Technology Services Pte Ltd,Singapore,117684) ,  Xi Zhang (Wintech Nano-Technology Services Pte Ltd,Singapore,117684) ,  Xiaomin Li (Wintech Nano-Technology Services Pte Ltd,Singapore,117684) ,  Younan Hua (Wintech Nano-Technology Services Pte Ltd,Singapore,117684) ,  Weikok Tee (Sumitomo Bakelite Singapore Pte Ltd,Singapore,758069) ,  Boonhwa Yee (Sumitomo Bakelite Singapore Pte Ltd,Singapore,758069) ,  Songlin Mao (Heraeus Zhaoyuan Precious Metal Materials Co. Ltd.,Zhaoyuan City,Shandong Province,China,265400) ,  Qinghong Yao (Wintech Nano-Technology Services Pte Ltd,Singapore,117684)
Material： IEEE Conference Proceedings  (IEEE Conf Proc)
Volume： 2019  Issue： IPFA  Page： 1-6  Publication year： 2019 
JST Material Number： W2441A  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)

Abstract/Point： Wire bond industry is transiti...

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Thesaurus term： *copper ,  *reliability(property) ,  *metal wire ,  *gold ,  wetting(humidity) ,  electrical conductivity ,  bias ,  high temperature ,  moisture ,  corrosion product ,  *chlorine ,  reliability test ,  chloride ,  catalyst ,  *aluminum

JST classification (3)： Graphic and image processing in general  (JE04010I) ,  Pattern recognition  (JE07000S) ,  Manufacturing technology of solid-state devices  (NC03030V)

Terms in the title (7)： Au ,  Al ,  Cu ,  HTS ,  ワイヤ ,  ボンド ,  Cl