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J-GLOBAL ID：202002288742473370   Reference number：20A0820882

Thermal Fatigue Life of Copper-Filled Laminated Micropore Based on Response Surface Methodology

応答曲面法に基づく銅充填積層マイクロポアの熱疲労寿命【JST・京大機械翻訳】

Author (3)： Li Xiao-Xiao (Beihang University,School of Reliability and Systems Engineering,Beijing,P.R. China,100191) ,  Sun Yu-Feng (Beihang University,School of Reliability and Systems Engineering,Beijing,P.R. China,100191) ,  Zhao Guang-Yan (Beihang University,School of Reliability and Systems Engineering,Beijing,P.R. China,100191)
Material： IEEE Conference Proceedings  (IEEE Conf Proc)
Volume： 2019  Issue： QR2MSE  Page： 1-7  Publication year： 2019 
JST Material Number： W2441A  Document type： Proceedings
Article type： 原著論文  Country of issue： United States (USA)  Language： ENGLISH (EN)

Abstract/Point： The copper-filled laminated mi...

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Thesaurus term： *thermal fatigue ,  *response surface methodology ,  interconnection ,  pore ,  interaction ,  experimental design ,  reliability(property) ,  stress concentration
Semi thesaurus term： 設計変数 ,  導電層 , 【Automatic Indexing@JST】

JST classification (3)： Graphic and image processing in general  (JE04010I) ,  Medical image processing  (JE04020T) ,  NMR in general  (BM07041R)

Terms in the title (4)： 応答曲面法 ,  銅 ,  ポア ,  疲労寿命