Proj
J-GLOBAL ID:202104001090814126  Research Project code:15658989

低温焼結圧電セラミックス材料を用いたセンサモジュール開発

低温焼結圧電セラミックス材料を用いたセンサモジュール開発
National award number:JPMJTM15F5
Study period:2015 - 2016
Organization (1):
Research responsibility: ( , 未来材料・システム研究所, 准教授 )
DOI: https://doi.org/10.52926/JPMJTM15F5
Terms in the title (3):
Terms in the title
Keywords automatically extracted from the title.
Research program:
Organization with control over the research:
Japan Science and Technology Agency

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