Proj
J-GLOBAL ID:202104003692924375  Research Project code:12101515

高温パワー半導体モジュール要素技術の開発

高温パワー半導体モジュール要素技術の開発
Study period:2012 - 2013
Organization (2):
Corporate responsibility:
Research responsibility: ( , 工学部, 教授 )
Terms in the title (4):
Terms in the title
Keywords automatically extracted from the title.
Research program:
Organization with control over the research:
Japan Science and Technology Agency

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