Proj
J-GLOBAL ID:202104007573774913  Research Project code:18066200

プロセスコストを極限まで下げた高スループット三次元積層型IC向け貫通配線(TSV)形成技術

プロセスコストを極限まで下げた高スループット三次元積層型IC向け貫通配線(TSV)形成技術
National award number:JPMJTR182B
Study period:2018 -
Organization (2):
Corporate responsibility:
Research responsibility: ( , システム理工学部, 教授 )
DOI: https://doi.org/10.52926/JPMJTR182B
Terms in the title (5):
Terms in the title
Keywords automatically extracted from the title.
Research program:
Organization with control over the research:
Japan Science and Technology Agency

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