Proj
J-GLOBAL ID：202104016036871499  Research Project code：7700400727

赤外光弾性法を用いた半導体及び光学単結晶の微小歪み測定検査装置

赤外光弾性法を用いた半導体及び光学単結晶の微小歪み測定検査装置
Study period：2002 -
Organization (1)：
ワイエムシステムズ株式会社

About ワイエムシステムズ株式会社


Corporate responsibility：
ワイエムシステムズ株式会社

About ワイエムシステムズ株式会社


Terms in the title (7)：
Terms in the title
Keywords automatically extracted from the title.
赤外

About 赤外

, 
光弾性法

About 光弾性法

, 
光学

About 光学

, 
単結晶

About 単結晶

, 
微小

About 微小

, 
歪み測定

About 歪み測定

, 
検査装置

About 検査装置

Research program：
Industry-Academia Collaborative R&D

About Industry-Academia Collaborative R&D

＞
R&D Programs Focused on Technology Transfer

About R&D Programs Focused on Technology Transfer

＞
Programs dosed application by FY2008

About Programs dosed application by FY2008

＞
Promoting business using advanced technology Development of Creative Technology Seeds

About Promoting business using advanced technology Development of Creative Technology Seeds

＞
Modeling of Innovative Research results

About Modeling of Innovative Research results


Organization with control over the research：
Japan Science and Technology Agency

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