Rchr
J-GLOBAL ID:200901003945183940   Update date: Jan. 17, 2024

Yasuda Kiyokazu

ヤスダ キヨカズ | Yasuda Kiyokazu
Affiliation and department:
Job title: Associate Professor
Homepage URL  (1): http://www.mapse.eng.osaka-u.ac.jp
Research field  (10): Metals and resources production ,  Material fabrication and microstructure control ,  Composite materials and interfaces ,  Nano/micro-systems ,  Nanobioscience ,  Nanomaterials ,  Structural and functional materials ,  Electronic devices and equipment ,  Thin-film surfaces and interfaces ,  Semiconductors, optical and atomic physics
Research keywords  (21): Nanotechnology ,  Biomimetics ,  Self-organization ,  Surface and interface ,  Electronic devices ,  Carbon materials ,  Nanoparticles ,  Composite materials ,  Metals ,  Electronic materials ,  Ultrasonic ,  Atmospheric pressure plasma ,  Laser plasma ,  Laser ,  Synchrotron radiation ,  Surface modification ,  Laser processing ,  Welding ,  Joining ,  Packaging engineering ,  Dissimilar materials joining
Research theme for competitive and other funds  (16):
  • 2009 - 2011 Development and Characterization of Self-Restoring Bio-Interface Materials
  • 2008 - 2011 3D Micro Structural and Functional System by Self-Replication
  • 2010 - 2010 Elucidation and emergence of self buildup replication phenomena of micro electronics materials
  • 2010 - 2010 Development of a new method for the formation of self-buildup type micro bumps by the reaction-phase transition cooperative phenomena
  • 2010 - 2010 反応・相転移協同現象による自己集積型微細バンプ形成法の開発
Show all
Papers (257):
  • Kiyokazu Yasuda, Yuki Takada, Shungo Kishida, Yinan Zhang, Jenn-Ming Song. Low Temperature Copper Direct Bonding by Laser-Assisted Sintering. Journal of Japan Institute of Copper. 2023. 62. 1. 196-199
  • Tai Wang, Kiyokazu Yasuda, Hiroshi Nishikawa. Study on the SPCC and CFRTP Hybrid Joint Performance Produced with Additional Nylon-6 Interlayer by Ultrasonic Plastic Welding. Polymers. 2022. 14. 23. 5235-5235
  • Yin-Chi Lu, Wei-Hsun Liao, Ting-Jui Wu, Kiyokazu Yasuda, Jenn-Ming Song. Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections. Nanomaterials. 2022. 12. 23. 4241-4241
  • Tai Wang, Kiyokazu Yasuda, Hiroshi Nishikawa. Fabrication of micron-sized protrusions on metal surface for metal/polymer easy-disassembly joining by selective laser melting technology. Materials & Design. 2022. 220. 110873-110873
  • Yu-Shun Su, Wei-Rong Yang, Wei-Wun Jheng, Watson Kuo, Shien-Der Tzeng, Kiyokazu Yasuda, Jenn-Ming Song. Optimization of Piezoresistive Strain Sensors Based on Gold Nanoparticle Deposits on PDMS Substrates for Highly Sensitive Human Pulse Sensing. Nanomaterials. 2022. 12. 13. 2312-2312
more...
MISC (25):
more...
Books (3):
  • Fortran90/95による実践プログラミング
    大阪大学出版会 2014 ISBN:4872594738
  • 最先端メディカルエンジニアリング
    名古屋大学メディカルエンジニアリング編集委員会 2013
  • 異種材料一体化のための最新技術~溶接・接着剤・一体成型・加飾~
    2012
Lectures and oral presentations  (1):
  • Nano-Modified Metal Bonding to Advanced Polymers for Automotive Systems
    (International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT2018), Oct. 24-26 Taipei 2018)
Education (2):
  • 1986 - 1988 Osaka University Graduate School of Engineering Faculty of Welding Engineering
  • 1982 - 1986 Osaka University School of Engineering Welding Engineering
Professional career (1):
  • Dr. Eng. (Osaka Univeristy)
Work history (8):
  • 2012/04 - 現在 Osaka University Graduate School of Engineering Associate professor
  • 2020/04 - 2023/03 Tokai National Higher Education and Research System Nagoya University National Composite Center Invited academic fellow
  • 2017/04 - 2020/03 Nagoya University National Composite Center Invited academic fellow
  • 2009/04 - 2012/03 Nagoya University Graduate School of Engineering Associate professor
  • 2005 - 2009 Osaka University Graduate School of Engineering Associate professor
Show all
Awards (7):
  • 2014/11 - Joining and Welding Research Institute/JWS Best Paper Award of Visual-JW2014
  • 2010/05 - JIEP JIEP Poster Award of ICEP2010
  • 2009/06 - School of Materials & Mineral Resources Engineering (SMMRE) USM Best Poster Award of RAMM & ASMP 2009
  • 2008/09 - JIEP Best Paper Award of MES2007
  • 2006/11 - IEEE CPMT Best Paper Award of IEEE IEMT2006
Show all
Association Membership(s) (11):
The Carbon Society of Japan ,  MRS-J (The Materials Research Society of Japan) ,  Smart Process Society ,  TMS (The Minerals, Metals & Materials Society) ,  IEEE EDS (Electron Devices Society) ,  The Japan Institute of Metals (JIM) ,  Japan Institute of Electronics Packaging (JIEP) ,  Japan Laser Processing Society (JLPS) ,  IEEE EPS (Electronics Packaging Society) ,  Japan Welding Society (JWS) ,  The Japan Society of Applied Physics (JSAP)
※ Researcher’s information displayed in J-GLOBAL is based on the information registered in researchmap. For details, see here.

Return to Previous Page