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J-GLOBAL ID:201002220129912670   Reference number:10A0794122

Self-Replicating Process for Micro Interconnect Array Pattern Using Solder/Polymer Hybrid Materials

はんだ/高分子複合体材料を用いたマイクロ相互配線アレイパターンのための自己複製プロセス
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Volume: 60th Vol.3  Page: 1416-1421  Publication year: 2010 
JST Material Number: H0393A  ISSN: 0569-5503  Document type: Proceedings
Article type: 原著論文  Country of issue: United States (USA)  Language: ENGLISH (EN)
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Printed circuits 

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