About YASUDA Kiyokazu
About Nagoya Univ., Nagoya
About Proceedings. Electronic Components & Technology Conference
About solder
About polymer complex
About duplicate
About flip chip method
About bump
About micro circuit technique
About filling material
About thermosetting plastic
About X-ray image
About phase separation
About Under Bump Metallurgy
About microphone array
About micro pattern
About high polymer material
About interconnect
About thermosetting resin
About Printed circuits
About はんだ
About 高分子
About 複合体材料
About 相互配線
About アレイパターン
About 自己複製
About プロセス