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ArticleJ-GLOBAL ID:200902000052045233整理番号:89A0053650

Subsurface damage profiling system for semiconductors materials.

半導体材料の表面直下の損傷のプロファイリングシステム

著者:IVES N A(Aerospace Corp., CA, USA)、LEUNG M S(Aerospace Corp., CA, USA)
資料名:Rev Sci Instrum 巻:59 号:10 ページ:2198-2201
発行年:1988年10月
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J-GLOBAL: Linking, Expanding and Sparking

About J-GLOBAL

Linking

J-GLOBAL links information that represents the key to research and development. For example, linking articles and patents with people (authors and inventors) enables the extraction of a sequence of information.
It’s useful for making new discoveries and uncovering new information.

Expanding

The system enables searches of similar kinds of content through linkage with external sites.
It helps you to obtain knowledge from dissimilar fields and discover concepts that cross the boundaries of specialisms.

Sparking

Through repeated linkage and expansioniteration, J-GLOBAL provides unexpected hints for problem-solving and the illumination of new ideas.