Art
J-GLOBAL ID：200902023228197914   Reference number：88A0561623

Epoxy resin molding materials with low thermal expansion coefficient.

低熱膨張性エポキシ樹脂系成形材料
Author (4)：
OGATA SHOJI

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(日立 日立研)

About 日立 日立研

, 
HOZOJI HIROYUKI

About HOZOJI HIROYUKI

(日立 日立研)

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, 
NUMATA SHUN'ICHI

About NUMATA SHUN'ICHI

(日立 日立研)

About 日立 日立研

, 
HORIE OSAMU

About HORIE OSAMU

(日立化成工業 南結城工場)

About 日立化成工業 南結城工場


Material：
熱硬化性樹脂講演討論会講演要旨集

About 熱硬化性樹脂講演討論会講演要旨集


Volume： 38th  Page： 123-126  Publication year： 1988 
JST Material Number： F0465B  Document type： Proceedings
Article type： 原著論文  Country of issue： Japan (JPN)  Language： JAPANESE (JA)
Thesaurus term：
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thermal expansion coefficient

About thermal expansion coefficient

,...
Semi thesaurus term：
Thesaurus term/Semi thesaurus term
Keywords indexed to the article.
All keywords is available on JDreamIII(charged).
On J-GLOBAL, this item will be available after more than half a year after the record posted. In addtion, medical articles require to login to MyJ-GLOBAL.
silica

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,...
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JST classification (1)：
JST classification
Category name(code) classified by JST.
Fillers,reinforcement 
(YH05030J)

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Terms in the title (3)：
Terms in the title
Keywords automatically extracted from the title.
低熱膨張

About 低熱膨張

, 
エポキシ樹脂系

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, 
成形材料

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