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ArticleJ-GLOBAL ID:200902023228197914整理番号:88A0561623

低熱膨張性エポキシ樹脂系成形材料

Epoxy resin molding materials with low thermal expansion coefficient.

著者:尾形正次(日立 日立研)、宝蔵寺裕之(日立 日立研)、沼田俊一(日立 日立研)・・・
資料名:熱硬化性樹脂講演討論会講演要旨集 巻:38th ページ:123-126
発行年:1988年
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