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ArticleJ-GLOBAL ID:200902212378598426整理番号:08A0416095

Resonant characteristics of the microelectronic Sn-Cu solder

マイクロエレクトロニクス用Sn‐Cuはんだの共振特性

著者:HUNG Fei-yi(Dep. of Materials Sci. and Engineering, National Cheng Kung Univ., Tainan 701, Taiwan)、LUI Truan-sheng(Dep. of Materials Sci. and Engineering, National Cheng Kung Univ., Tainan 701, Taiwan)、CHEN Li-hui(Dep. of Materials Sci. and Engineering, National Cheng Kung Univ., Tainan 701, Taiwan)・・・
資料名:J Alloy Compd 巻:457 号:1-2 ページ:171-176
発行年:2008年06月12日
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